METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

A method for producing a semiconductor device includes bonding a transfer layer disposed on a first substrate to a second substrate and detaching the transfer layer from the first substrate. In bonding the transfer layer disposed on the first substrate to the second substrate, the method further inc...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	KAMINE TETSUJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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