ELECTRONIC PACKAGE STRUCTURE

An electronic package structure including a first carrier, at least one first electronic element, at least one second electronic element, and an encapsulant is provided. The first carrier has a first carrying surface and a second carrying surface opposite to the first carrying surface. The first ele...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHEN DA-JUNG, LIN YING, LU BAU-RU, WEN CHAUUN, FANG CHUNG-SHIUN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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