WAFER CENTER FINDING WITH CONTACT IMAGE SENSORS

A number of wafer center finding methods and systems are disclosed herein that improve upon existing techniques used in semiconductor manufacturing.

Bibliographische Detailangaben

1. Verfasser:	FOGEL PAUL E
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DETECTING MASSES OR OBJECTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GEOPHYSICS GRAVITATIONAL MEASUREMENTS MEASURING PHYSICS SEMICONDUCTOR DEVICES TESTING
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