Flip Chip Assembly Having Improved Thermal Dissipation

An assembly comprises a stiffener, a circuit substrate and an IC chip. The stiffener has a surface with a first region and a second region. The circuit substrate covers at least a portion of the first region of the stiffener, while the IC chip overlies at least a portion of each of the first and sec...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OSENBACH JOHN W, AMIN AHMED, SHILLING THOMAS H, VACCARO BRIAN T, CROUTHAMEL DAVID L
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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