INSPECTION METHOD FOR PROTECTING IMAGE SENSOR DEVICES WITH FRONT SURFACE PROTECTION

INSPECTION METHOD FOR PROTECTING IMAGE SENSOR DEVICES WITH FRONT SURFACE PROTECTION

A method for inspecting a semiconductor wafer fabricated for image sensing operation that has had a transparent protective tape layer applied to a front or active wafer surface. The method includes quantifying chip defects in the image sensor wafer that lie under the protective layer using automatic...

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Hauptverfasser: KRYWANCZYK TIMOTHY C, NEARY TIMOTHY E, PROBSTFIELD ERIK M
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PHYSICS
SEMICONDUCTOR DEVICES
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creator KRYWANCZYK TIMOTHY C
NEARY TIMOTHY E
PROBSTFIELD ERIK M
description A method for inspecting a semiconductor wafer fabricated for image sensing operation that has had a transparent protective tape layer applied to a front or active wafer surface. The method includes quantifying chip defects in the image sensor wafer that lie under the protective layer using automatic disposition equipment.
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subjects BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PHYSICS
SEMICONDUCTOR DEVICES
title INSPECTION METHOD FOR PROTECTING IMAGE SENSOR DEVICES WITH FRONT SURFACE PROTECTION
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