Statistical process control of solder paste stenciling using a replicated solder paste feature distributed across a printed circuit board

Methods and systems for improving a solder paste stenciling process include obtaining data pertaining to solder paste deposits on a printed circuit board, the solder paste deposits deposited by a solder paste stenciling process through multiple identical apertures of a solder paste stencil, statisti...

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Bibliographische Detailangaben
Hauptverfasser:	LEINBACH GLEN E, JOHNSON STACY KALISZ
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Methods and systems for improving a solder paste stenciling process include obtaining data pertaining to solder paste deposits on a printed circuit board, the solder paste deposits deposited by a solder paste stenciling process through multiple identical apertures of a solder paste stencil, statistically analyzing the data, and correlating the data with a plurality of solder paste stenciling process problems to identify at least one solder paste stenciling process problem in the solder paste stenciling process.