Plastic surface mount large area power device

A low profile, 1 or 2 die design, surface mount high power microelectronic package with coefficient of expansion (CTE) matched materials such as Silicon die to Molybdenum conductor (bond pads). The CTE matching of the materials in the package enables the device to withstand repeated, extreme tempera...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	AUTRY TRACY, BARNES CHRISTOPHER ALAN, KELLY STEPHEN G, DIGIACOMO GEORGE A
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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