Method of making a semiconductor package and method of making a semiconductor device
The present invention relates to a semiconductor package and a semiconductor device and a method of making the same. The method of making the semiconductor package comprises: providing a substrate; attaching a chip to a surface of the substrate; forming a plurality of connecting elements for electri...
Gespeichert in:
| Hauptverfasser: | , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | SUNG WEI-YUEH LEE CHENG-YIN WU YEN-YI CHANG CHIEN PAO-HUEI WENG GWO-LIANG CHU CHIIH |
| description | The present invention relates to a semiconductor package and a semiconductor device and a method of making the same. The method of making the semiconductor package comprises: providing a substrate; attaching a chip to a surface of the substrate; forming a plurality of connecting elements for electrically connecting the chip and the substrate; forming a plurality of first conductive bodies on the surface of the substrate; forming a molding compound for encapsulating the surface of the substrate, the chip, the connecting elements and the first conductive bodies; and removing a part of a border portion of the molding compound, so that the molding compound has two heights and one end of each first conductive bodies is exposed. Thereby, the molding compound covers the entire surface of the substrate, so that the bonding pads on the surface of the substrate will not be polluted. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2008076208A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2008076208A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2008076208A13</originalsourceid><addsrcrecordid>eNrjZAjxTS3JyE9RyE9TyE3MzsxLV0hUKE7NzUzOz0spTS7JL1IoSEzOTkxPVUjMS1HIJaQ4JbUsMzmVh4E1LTGnOJUXSnMzKLu5hjh76KYW5MenFgNNTM1LLYkPDTYyMLAwMDczMrBwNDQmThUAPB85Wg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method of making a semiconductor package and method of making a semiconductor device</title><source>esp@cenet</source><creator>SUNG WEI-YUEH ; LEE CHENG-YIN ; WU YEN-YI ; CHANG CHIEN PAO-HUEI ; WENG GWO-LIANG ; CHU CHIIH</creator><creatorcontrib>SUNG WEI-YUEH ; LEE CHENG-YIN ; WU YEN-YI ; CHANG CHIEN PAO-HUEI ; WENG GWO-LIANG ; CHU CHIIH</creatorcontrib><description>The present invention relates to a semiconductor package and a semiconductor device and a method of making the same. The method of making the semiconductor package comprises: providing a substrate; attaching a chip to a surface of the substrate; forming a plurality of connecting elements for electrically connecting the chip and the substrate; forming a plurality of first conductive bodies on the surface of the substrate; forming a molding compound for encapsulating the surface of the substrate, the chip, the connecting elements and the first conductive bodies; and removing a part of a border portion of the molding compound, so that the molding compound has two heights and one end of each first conductive bodies is exposed. Thereby, the molding compound covers the entire surface of the substrate, so that the bonding pads on the surface of the substrate will not be polluted.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2008</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20080327&DB=EPODOC&CC=US&NR=2008076208A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20080327&DB=EPODOC&CC=US&NR=2008076208A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SUNG WEI-YUEH</creatorcontrib><creatorcontrib>LEE CHENG-YIN</creatorcontrib><creatorcontrib>WU YEN-YI</creatorcontrib><creatorcontrib>CHANG CHIEN PAO-HUEI</creatorcontrib><creatorcontrib>WENG GWO-LIANG</creatorcontrib><creatorcontrib>CHU CHIIH</creatorcontrib><title>Method of making a semiconductor package and method of making a semiconductor device</title><description>The present invention relates to a semiconductor package and a semiconductor device and a method of making the same. The method of making the semiconductor package comprises: providing a substrate; attaching a chip to a surface of the substrate; forming a plurality of connecting elements for electrically connecting the chip and the substrate; forming a plurality of first conductive bodies on the surface of the substrate; forming a molding compound for encapsulating the surface of the substrate, the chip, the connecting elements and the first conductive bodies; and removing a part of a border portion of the molding compound, so that the molding compound has two heights and one end of each first conductive bodies is exposed. Thereby, the molding compound covers the entire surface of the substrate, so that the bonding pads on the surface of the substrate will not be polluted.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2008</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAjxTS3JyE9RyE9TyE3MzsxLV0hUKE7NzUzOz0spTS7JL1IoSEzOTkxPVUjMS1HIJaQ4JbUsMzmVh4E1LTGnOJUXSnMzKLu5hjh76KYW5MenFgNNTM1LLYkPDTYyMLAwMDczMrBwNDQmThUAPB85Wg</recordid><startdate>20080327</startdate><enddate>20080327</enddate><creator>SUNG WEI-YUEH</creator><creator>LEE CHENG-YIN</creator><creator>WU YEN-YI</creator><creator>CHANG CHIEN PAO-HUEI</creator><creator>WENG GWO-LIANG</creator><creator>CHU CHIIH</creator><scope>EVB</scope></search><sort><creationdate>20080327</creationdate><title>Method of making a semiconductor package and method of making a semiconductor device</title><author>SUNG WEI-YUEH ; LEE CHENG-YIN ; WU YEN-YI ; CHANG CHIEN PAO-HUEI ; WENG GWO-LIANG ; CHU CHIIH</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2008076208A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2008</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>SUNG WEI-YUEH</creatorcontrib><creatorcontrib>LEE CHENG-YIN</creatorcontrib><creatorcontrib>WU YEN-YI</creatorcontrib><creatorcontrib>CHANG CHIEN PAO-HUEI</creatorcontrib><creatorcontrib>WENG GWO-LIANG</creatorcontrib><creatorcontrib>CHU CHIIH</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SUNG WEI-YUEH</au><au>LEE CHENG-YIN</au><au>WU YEN-YI</au><au>CHANG CHIEN PAO-HUEI</au><au>WENG GWO-LIANG</au><au>CHU CHIIH</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method of making a semiconductor package and method of making a semiconductor device</title><date>2008-03-27</date><risdate>2008</risdate><abstract>The present invention relates to a semiconductor package and a semiconductor device and a method of making the same. The method of making the semiconductor package comprises: providing a substrate; attaching a chip to a surface of the substrate; forming a plurality of connecting elements for electrically connecting the chip and the substrate; forming a plurality of first conductive bodies on the surface of the substrate; forming a molding compound for encapsulating the surface of the substrate, the chip, the connecting elements and the first conductive bodies; and removing a part of a border portion of the molding compound, so that the molding compound has two heights and one end of each first conductive bodies is exposed. Thereby, the molding compound covers the entire surface of the substrate, so that the bonding pads on the surface of the substrate will not be polluted.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US2008076208A1 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Method of making a semiconductor package and method of making a semiconductor device |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-21T21%3A11%3A04IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SUNG%20WEI-YUEH&rft.date=2008-03-27&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2008076208A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |