METHOD FOR FORMING A PLATED MICROVIA INTERCONNECT

A method for forming a plated microvia interconnect. An external dielectric layer (EDL) is mounted on a substrate in direct mechanical contact with a conductive element thereon. An opening in the EDL exposes the conductive element and create a microvia in the EDL. A sidewall and bottom wall surface...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	JIMAREZ MIGUEL A, TYTRAN-PALOMAKI CHERYL L, MARKOVICH VOYA R, KEESLER ROSS W, RAI RAJINDER S
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A method for forming a plated microvia interconnect. An external dielectric layer (EDL) is mounted on a substrate in direct mechanical contact with a conductive element thereon. An opening in the EDL exposes the conductive element and create a microvia in the EDL. A sidewall and bottom wall surface of the microvia are treated to promote adhesion of copper and are plated with a layer of copper that includes a copper layer on a copper seed layer and is in direct mechanical and electrical contact with the conductive element. A wet solder paste is deposited on the layer of copper to overfill a remaining portion of the microvia. The solder paste is reflowed to form a solder bump in and over the remaining portion of the microvia to form the plated microvia interconnect. A stiffener is attached to the EDL using a first adhesive.