Microelectronic element chips

Apparatus including a chip substrate having a first chip surface facing away from a second chip surface; an array of microelectronic elements on the first chip surface; and an array of conductors each in communication with one of the microelectronic elements, the conductors passing through the chip...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	AKSYUK VLADIMIR A, LAI WARREN YIUO, KORNBLIT AVINOAM, FULLOWAN ROBERT FRANCIS, TAYLOR JOSEPH ASHLEY, BASAVANHALLY NAGESH R
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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