Light-emitting devices and methods for manufacturing the same

Light-emitting devices and methods for manufacturing the same

Light-emitting device assemblies are described. The assemblies can include a light-emitting device, an optional package supporting the light-emitting device, and a base supporting the light-emitting device or the optional package. The base may include a protrusion extending in the direction of the l...

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Hauptverfasser: HOEPFNER CHRISTIAN, PANACCIONE PAUL, ERCHAK ALEXEI A
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Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator HOEPFNER CHRISTIAN
PANACCIONE PAUL
ERCHAK ALEXEI A
description Light-emitting device assemblies are described. The assemblies can include a light-emitting device, an optional package supporting the light-emitting device, and a base supporting the light-emitting device or the optional package. The base may include a protrusion extending in the direction of the light-emitting device. The thermally conductive pathway can extend between the light-emitting device and the base, such that the thermally conductive pathway includes the protrusion. Other assemblies can include a light-emitting device, a support substrate, and a layer of dielectric material on the support substrate. An aperture may be defined by the dielectric material through which a thermally conductive material (e.g., a portion of the support substrate) can extend to facilitate thermal communication between the support substrate and the light-emitting device. Thermal communication between the support substrate and the light-emitting device can increase the removal of thermal energy generated by the device.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2007267642A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2007267642A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2007267642A13</originalsourceid><addsrcrecordid>eNrjZLD1yUzPKNFNzc0sKcnMS1dISS3LTE4tVkjMS1HITS3JyE8pVkjLL1LITcwrTUtMLiktAqkqyUhVKE7MTeVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGBuZGZuZmJkaOhsbEqQIA6VYxMg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Light-emitting devices and methods for manufacturing the same</title><source>esp@cenet</source><creator>HOEPFNER CHRISTIAN ; PANACCIONE PAUL ; ERCHAK ALEXEI A</creator><creatorcontrib>HOEPFNER CHRISTIAN ; PANACCIONE PAUL ; ERCHAK ALEXEI A</creatorcontrib><description>Light-emitting device assemblies are described. The assemblies can include a light-emitting device, an optional package supporting the light-emitting device, and a base supporting the light-emitting device or the optional package. The base may include a protrusion extending in the direction of the light-emitting device. The thermally conductive pathway can extend between the light-emitting device and the base, such that the thermally conductive pathway includes the protrusion. Other assemblies can include a light-emitting device, a support substrate, and a layer of dielectric material on the support substrate. An aperture may be defined by the dielectric material through which a thermally conductive material (e.g., a portion of the support substrate) can extend to facilitate thermal communication between the support substrate and the light-emitting device. Thermal communication between the support substrate and the light-emitting device can increase the removal of thermal energy generated by the device.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20071122&amp;DB=EPODOC&amp;CC=US&amp;NR=2007267642A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20071122&amp;DB=EPODOC&amp;CC=US&amp;NR=2007267642A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HOEPFNER CHRISTIAN</creatorcontrib><creatorcontrib>PANACCIONE PAUL</creatorcontrib><creatorcontrib>ERCHAK ALEXEI A</creatorcontrib><title>Light-emitting devices and methods for manufacturing the same</title><description>Light-emitting device assemblies are described. The assemblies can include a light-emitting device, an optional package supporting the light-emitting device, and a base supporting the light-emitting device or the optional package. The base may include a protrusion extending in the direction of the light-emitting device. The thermally conductive pathway can extend between the light-emitting device and the base, such that the thermally conductive pathway includes the protrusion. Other assemblies can include a light-emitting device, a support substrate, and a layer of dielectric material on the support substrate. An aperture may be defined by the dielectric material through which a thermally conductive material (e.g., a portion of the support substrate) can extend to facilitate thermal communication between the support substrate and the light-emitting device. Thermal communication between the support substrate and the light-emitting device can increase the removal of thermal energy generated by the device.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLD1yUzPKNFNzc0sKcnMS1dISS3LTE4tVkjMS1HITS3JyE8pVkjLL1LITcwrTUtMLiktAqkqyUhVKE7MTeVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGBuZGZuZmJkaOhsbEqQIA6VYxMg</recordid><startdate>20071122</startdate><enddate>20071122</enddate><creator>HOEPFNER CHRISTIAN</creator><creator>PANACCIONE PAUL</creator><creator>ERCHAK ALEXEI A</creator><scope>EVB</scope></search><sort><creationdate>20071122</creationdate><title>Light-emitting devices and methods for manufacturing the same</title><author>HOEPFNER CHRISTIAN ; PANACCIONE PAUL ; ERCHAK ALEXEI A</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2007267642A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2007</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>HOEPFNER CHRISTIAN</creatorcontrib><creatorcontrib>PANACCIONE PAUL</creatorcontrib><creatorcontrib>ERCHAK ALEXEI A</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HOEPFNER CHRISTIAN</au><au>PANACCIONE PAUL</au><au>ERCHAK ALEXEI A</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Light-emitting devices and methods for manufacturing the same</title><date>2007-11-22</date><risdate>2007</risdate><abstract>Light-emitting device assemblies are described. The assemblies can include a light-emitting device, an optional package supporting the light-emitting device, and a base supporting the light-emitting device or the optional package. The base may include a protrusion extending in the direction of the light-emitting device. The thermally conductive pathway can extend between the light-emitting device and the base, such that the thermally conductive pathway includes the protrusion. Other assemblies can include a light-emitting device, a support substrate, and a layer of dielectric material on the support substrate. An aperture may be defined by the dielectric material through which a thermally conductive material (e.g., a portion of the support substrate) can extend to facilitate thermal communication between the support substrate and the light-emitting device. Thermal communication between the support substrate and the light-emitting device can increase the removal of thermal energy generated by the device.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Light-emitting devices and methods for manufacturing the same
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-19T00%3A40%3A14IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HOEPFNER%20CHRISTIAN&rft.date=2007-11-22&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2007267642A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true