Semiconductor device using semiconductor chip

Semiconductor device using semiconductor chip

A semiconductor device includes an insulating substrate 2 having an obverse surface formed with a die pad 3 , a rectangular semiconductor chip 7 such as an LED chip bonded to the die pad with a die bonding material 10 , and a molded portion 9 made of a synthetic resin for packaging the semiconductor...

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Hauptverfasser: YAMAGUCHI TOMOJI, ISOKAWA SHINJI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator YAMAGUCHI TOMOJI
ISOKAWA SHINJI
description A semiconductor device includes an insulating substrate 2 having an obverse surface formed with a die pad 3 , a rectangular semiconductor chip 7 such as an LED chip bonded to the die pad with a die bonding material 10 , and a molded portion 9 made of a synthetic resin for packaging the semiconductor chip. The die pad 3 may be rectangular with dimensions close to those of the semiconductor chip or circular with a diameter close to the diagonal dimension of the semiconductor chip, whereby the positioning and orienting of the semiconductor chip can be accurately performed in bonding the semiconductor chip.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Semiconductor device using semiconductor chip
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