Novel chemical composition to reduce defects

A chemical composition and methods to remove defects while maintaining corrosion protection of conductors on a substrate are described. The composition includes a conductive solution, a corrosion inhibitor; and a surfactant. A surfactant-to-inhibitor ratio in the composition is a function of a metal...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: CASTILLO-MEJIA DANILO, ANDRYUSHCHENKO TATYANA N, BUEHLER MARK F, SRIRAM MANDYAM A
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator CASTILLO-MEJIA DANILO
ANDRYUSHCHENKO TATYANA N
BUEHLER MARK F
SRIRAM MANDYAM A
description A chemical composition and methods to remove defects while maintaining corrosion protection of conductors on a substrate are described. The composition includes a conductive solution, a corrosion inhibitor; and a surfactant. A surfactant-to-inhibitor ratio in the composition is a function of a metal. The surfactant is an anionic surfactant, a non-ionic surfactant, or any combination thereof. The concentration of the corrosion inhibitor in the chemical composition can be low. The corrosion inhibitor can form soft bonds with a conductor material. The conductive solution can be a high ionic strength solution. The composition is applied to a wafer having conductors on a substrate. At least two conductors on the substrate have different potentials. The composition can be used to clean the wafer after forming the conductors on the substrate. The composition can be used for chemical mechanical polishing of the wafer.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2007228011A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2007228011A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2007228011A13</originalsourceid><addsrcrecordid>eNrjZNDxyy9LzVFIzkjNzUxOBDLycwvyizNLMvPzFEryFYpSU0qTUxVSUtNSk0uKeRhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJfGiwkYGBuZGRhYGhoaOhMXGqAEMsKrw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Novel chemical composition to reduce defects</title><source>esp@cenet</source><creator>CASTILLO-MEJIA DANILO ; ANDRYUSHCHENKO TATYANA N ; BUEHLER MARK F ; SRIRAM MANDYAM A</creator><creatorcontrib>CASTILLO-MEJIA DANILO ; ANDRYUSHCHENKO TATYANA N ; BUEHLER MARK F ; SRIRAM MANDYAM A</creatorcontrib><description>A chemical composition and methods to remove defects while maintaining corrosion protection of conductors on a substrate are described. The composition includes a conductive solution, a corrosion inhibitor; and a surfactant. A surfactant-to-inhibitor ratio in the composition is a function of a metal. The surfactant is an anionic surfactant, a non-ionic surfactant, or any combination thereof. The concentration of the corrosion inhibitor in the chemical composition can be low. The corrosion inhibitor can form soft bonds with a conductor material. The conductive solution can be a high ionic strength solution. The composition is applied to a wafer having conductors on a substrate. At least two conductors on the substrate have different potentials. The composition can be used to clean the wafer after forming the conductors on the substrate. The composition can be used for chemical mechanical polishing of the wafer.</description><language>eng</language><subject>ADHESIVES ; CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS ; CHEMISTRY ; DECORATIVE ARTS ; DYES ; GLASS ; JOINING GLASS TO GLASS OR OTHER MATERIALS ; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE ; METALLURGY ; MINERAL OR SLAG WOOL ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; MOSAICS ; NATURAL RESINS ; PAINTS ; PAPERHANGING ; PERFORMING OPERATIONS ; POLISHES ; PRODUCING DECORATIVE EFFECTS ; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS ; SURFACE TREATMENT OF GLASS ; TARSIA WORK ; TRANSPORTING</subject><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20071004&amp;DB=EPODOC&amp;CC=US&amp;NR=2007228011A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20071004&amp;DB=EPODOC&amp;CC=US&amp;NR=2007228011A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CASTILLO-MEJIA DANILO</creatorcontrib><creatorcontrib>ANDRYUSHCHENKO TATYANA N</creatorcontrib><creatorcontrib>BUEHLER MARK F</creatorcontrib><creatorcontrib>SRIRAM MANDYAM A</creatorcontrib><title>Novel chemical composition to reduce defects</title><description>A chemical composition and methods to remove defects while maintaining corrosion protection of conductors on a substrate are described. The composition includes a conductive solution, a corrosion inhibitor; and a surfactant. A surfactant-to-inhibitor ratio in the composition is a function of a metal. The surfactant is an anionic surfactant, a non-ionic surfactant, or any combination thereof. The concentration of the corrosion inhibitor in the chemical composition can be low. The corrosion inhibitor can form soft bonds with a conductor material. The conductive solution can be a high ionic strength solution. The composition is applied to a wafer having conductors on a substrate. At least two conductors on the substrate have different potentials. The composition can be used to clean the wafer after forming the conductors on the substrate. The composition can be used for chemical mechanical polishing of the wafer.</description><subject>ADHESIVES</subject><subject>CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS</subject><subject>CHEMISTRY</subject><subject>DECORATIVE ARTS</subject><subject>DYES</subject><subject>GLASS</subject><subject>JOINING GLASS TO GLASS OR OTHER MATERIALS</subject><subject>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</subject><subject>METALLURGY</subject><subject>MINERAL OR SLAG WOOL</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>MOSAICS</subject><subject>NATURAL RESINS</subject><subject>PAINTS</subject><subject>PAPERHANGING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHES</subject><subject>PRODUCING DECORATIVE EFFECTS</subject><subject>SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS</subject><subject>SURFACE TREATMENT OF GLASS</subject><subject>TARSIA WORK</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNDxyy9LzVFIzkjNzUxOBDLycwvyizNLMvPzFEryFYpSU0qTUxVSUtNSk0uKeRhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJfGiwkYGBuZGRhYGhoaOhMXGqAEMsKrw</recordid><startdate>20071004</startdate><enddate>20071004</enddate><creator>CASTILLO-MEJIA DANILO</creator><creator>ANDRYUSHCHENKO TATYANA N</creator><creator>BUEHLER MARK F</creator><creator>SRIRAM MANDYAM A</creator><scope>EVB</scope></search><sort><creationdate>20071004</creationdate><title>Novel chemical composition to reduce defects</title><author>CASTILLO-MEJIA DANILO ; ANDRYUSHCHENKO TATYANA N ; BUEHLER MARK F ; SRIRAM MANDYAM A</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2007228011A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2007</creationdate><topic>ADHESIVES</topic><topic>CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS</topic><topic>CHEMISTRY</topic><topic>DECORATIVE ARTS</topic><topic>DYES</topic><topic>GLASS</topic><topic>JOINING GLASS TO GLASS OR OTHER MATERIALS</topic><topic>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</topic><topic>METALLURGY</topic><topic>MINERAL OR SLAG WOOL</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>MOSAICS</topic><topic>NATURAL RESINS</topic><topic>PAINTS</topic><topic>PAPERHANGING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHES</topic><topic>PRODUCING DECORATIVE EFFECTS</topic><topic>SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS</topic><topic>SURFACE TREATMENT OF GLASS</topic><topic>TARSIA WORK</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>CASTILLO-MEJIA DANILO</creatorcontrib><creatorcontrib>ANDRYUSHCHENKO TATYANA N</creatorcontrib><creatorcontrib>BUEHLER MARK F</creatorcontrib><creatorcontrib>SRIRAM MANDYAM A</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CASTILLO-MEJIA DANILO</au><au>ANDRYUSHCHENKO TATYANA N</au><au>BUEHLER MARK F</au><au>SRIRAM MANDYAM A</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Novel chemical composition to reduce defects</title><date>2007-10-04</date><risdate>2007</risdate><abstract>A chemical composition and methods to remove defects while maintaining corrosion protection of conductors on a substrate are described. The composition includes a conductive solution, a corrosion inhibitor; and a surfactant. A surfactant-to-inhibitor ratio in the composition is a function of a metal. The surfactant is an anionic surfactant, a non-ionic surfactant, or any combination thereof. The concentration of the corrosion inhibitor in the chemical composition can be low. The corrosion inhibitor can form soft bonds with a conductor material. The conductive solution can be a high ionic strength solution. The composition is applied to a wafer having conductors on a substrate. At least two conductors on the substrate have different potentials. The composition can be used to clean the wafer after forming the conductors on the substrate. The composition can be used for chemical mechanical polishing of the wafer.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2007228011A1
source esp@cenet
subjects ADHESIVES
CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS
CHEMISTRY
DECORATIVE ARTS
DYES
GLASS
JOINING GLASS TO GLASS OR OTHER MATERIALS
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MINERAL OR SLAG WOOL
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
MOSAICS
NATURAL RESINS
PAINTS
PAPERHANGING
PERFORMING OPERATIONS
POLISHES
PRODUCING DECORATIVE EFFECTS
SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS
SURFACE TREATMENT OF GLASS
TARSIA WORK
TRANSPORTING
title Novel chemical composition to reduce defects
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-27T02%3A12%3A44IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=CASTILLO-MEJIA%20DANILO&rft.date=2007-10-04&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2007228011A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true