Printed Circuit Board and Manufacturing Method Thereof

Printed Circuit Board and Manufacturing Method Thereof

A plurality of wiring patterns in a stripe form are formed to be parallel to one another on one surface of a base insulating layer. The wiring patterns each have a layered structure including a conductive layer and a wiring layer. A thin metal film is formed on the other surface of the base insulati...

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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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description A plurality of wiring patterns in a stripe form are formed to be parallel to one another on one surface of a base insulating layer. The wiring patterns each have a layered structure including a conductive layer and a wiring layer. A thin metal film is formed on the other surface of the base insulating layer, and a plurality of ground patterns in a stripe form are formed to be parallel to one another on the thin metal film. The wiring patterns and the ground patterns are provided in a staggered manner so that they are not opposed to one another with the base insulating layer interposed therebetween. In other words, the ground patterns are provided to be opposed to regions between the wiring patterns.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Printed Circuit Board and Manufacturing Method Thereof
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