NONDESTRUCTIVE RELIABILITY MONITORING METHOD FOR ADHESIVELY BONDED STRUCTURES WHOSE SENSITIVITY IS IMPROVED BY USING PIEZOELECTRIC OR CONDUCTIVE MATERIALS
A method is disclosed for testing bonded part integrity of bonded structures with increased sensitivity and in a nondestructive manner. The method includes the steps of: mixing a piezoelectric material or an electrically conductive material with an adhesive agent, curing the adhesive agent in betwee...
Gespeichert in:
| Hauptverfasser: | , , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | HWANG HUI-YUN YOON SOON-HO KIM BYUNGUL LEE DAI-GIL LEE SEUNG-MIN CHIN WOO-SEOK KWON JAE-WOOK |
| description | A method is disclosed for testing bonded part integrity of bonded structures with increased sensitivity and in a nondestructive manner. The method includes the steps of: mixing a piezoelectric material or an electrically conductive material with an adhesive agent, curing the adhesive agent in between bonding target objects, electrically connecting the bonding target objects to one another, causing an electric current to flow through the bonding target objects to measure a quantity of electric charges flowing between the bonding target objects, and determining existence of bonding damage between the bonding target objects and the adhesive agent based on the quantity of electric charges and predicting a remaining life span of the bonded structures based on a data indicating a correlation between the quantity of electric charges and a predetermined fatigue life. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2007214623A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2007214623A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2007214623A13</originalsourceid><addsrcrecordid>eNqNzrEKwjAQxvEuDqK-w4Gz0FbROU2v9iBNJJdW6lKKxEm0UJ_GpzVFH8Dplv_34-bRWxudIztbS0cNgkVFIiNFroXKaHLGkj5Cha40ORTGgshL5JCqFrJpm8N3XVtkOJeGERg1U-AmhBioOlnThDBroeaJOxFeDCqUzpKEgMog_T6ohENLQvEymt36--hXv7uI1gU6WW788Oz8OPRX__CvruY0jg9pstunW5Fs_6s-5Y5Fiw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>NONDESTRUCTIVE RELIABILITY MONITORING METHOD FOR ADHESIVELY BONDED STRUCTURES WHOSE SENSITIVITY IS IMPROVED BY USING PIEZOELECTRIC OR CONDUCTIVE MATERIALS</title><source>esp@cenet</source><creator>HWANG HUI-YUN ; YOON SOON-HO ; KIM BYUNGUL ; LEE DAI-GIL ; LEE SEUNG-MIN ; CHIN WOO-SEOK ; KWON JAE-WOOK</creator><creatorcontrib>HWANG HUI-YUN ; YOON SOON-HO ; KIM BYUNGUL ; LEE DAI-GIL ; LEE SEUNG-MIN ; CHIN WOO-SEOK ; KWON JAE-WOOK</creatorcontrib><description>A method is disclosed for testing bonded part integrity of bonded structures with increased sensitivity and in a nondestructive manner. The method includes the steps of: mixing a piezoelectric material or an electrically conductive material with an adhesive agent, curing the adhesive agent in between bonding target objects, electrically connecting the bonding target objects to one another, causing an electric current to flow through the bonding target objects to measure a quantity of electric charges flowing between the bonding target objects, and determining existence of bonding damage between the bonding target objects and the adhesive agent based on the quantity of electric charges and predicting a remaining life span of the bonded structures based on a data indicating a correlation between the quantity of electric charges and a predetermined fatigue life.</description><language>eng</language><subject>DEAF-AID SETS ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRICITY ; LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS ; MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PHYSICS ; PUBLIC ADDRESS SYSTEMS ; TESTING</subject><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20070920&DB=EPODOC&CC=US&NR=2007214623A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20070920&DB=EPODOC&CC=US&NR=2007214623A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HWANG HUI-YUN</creatorcontrib><creatorcontrib>YOON SOON-HO</creatorcontrib><creatorcontrib>KIM BYUNGUL</creatorcontrib><creatorcontrib>LEE DAI-GIL</creatorcontrib><creatorcontrib>LEE SEUNG-MIN</creatorcontrib><creatorcontrib>CHIN WOO-SEOK</creatorcontrib><creatorcontrib>KWON JAE-WOOK</creatorcontrib><title>NONDESTRUCTIVE RELIABILITY MONITORING METHOD FOR ADHESIVELY BONDED STRUCTURES WHOSE SENSITIVITY IS IMPROVED BY USING PIEZOELECTRIC OR CONDUCTIVE MATERIALS</title><description>A method is disclosed for testing bonded part integrity of bonded structures with increased sensitivity and in a nondestructive manner. The method includes the steps of: mixing a piezoelectric material or an electrically conductive material with an adhesive agent, curing the adhesive agent in between bonding target objects, electrically connecting the bonding target objects to one another, causing an electric current to flow through the bonding target objects to measure a quantity of electric charges flowing between the bonding target objects, and determining existence of bonding damage between the bonding target objects and the adhesive agent based on the quantity of electric charges and predicting a remaining life span of the bonded structures based on a data indicating a correlation between the quantity of electric charges and a predetermined fatigue life.</description><subject>DEAF-AID SETS</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRICITY</subject><subject>LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS</subject><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>PUBLIC ADDRESS SYSTEMS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNzrEKwjAQxvEuDqK-w4Gz0FbROU2v9iBNJJdW6lKKxEm0UJ_GpzVFH8Dplv_34-bRWxudIztbS0cNgkVFIiNFroXKaHLGkj5Cha40ORTGgshL5JCqFrJpm8N3XVtkOJeGERg1U-AmhBioOlnThDBroeaJOxFeDCqUzpKEgMog_T6ohENLQvEymt36--hXv7uI1gU6WW788Oz8OPRX__CvruY0jg9pstunW5Fs_6s-5Y5Fiw</recordid><startdate>20070920</startdate><enddate>20070920</enddate><creator>HWANG HUI-YUN</creator><creator>YOON SOON-HO</creator><creator>KIM BYUNGUL</creator><creator>LEE DAI-GIL</creator><creator>LEE SEUNG-MIN</creator><creator>CHIN WOO-SEOK</creator><creator>KWON JAE-WOOK</creator><scope>EVB</scope></search><sort><creationdate>20070920</creationdate><title>NONDESTRUCTIVE RELIABILITY MONITORING METHOD FOR ADHESIVELY BONDED STRUCTURES WHOSE SENSITIVITY IS IMPROVED BY USING PIEZOELECTRIC OR CONDUCTIVE MATERIALS</title><author>HWANG HUI-YUN ; YOON SOON-HO ; KIM BYUNGUL ; LEE DAI-GIL ; LEE SEUNG-MIN ; CHIN WOO-SEOK ; KWON JAE-WOOK</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2007214623A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2007</creationdate><topic>DEAF-AID SETS</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRICITY</topic><topic>LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS</topic><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>PUBLIC ADDRESS SYSTEMS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>HWANG HUI-YUN</creatorcontrib><creatorcontrib>YOON SOON-HO</creatorcontrib><creatorcontrib>KIM BYUNGUL</creatorcontrib><creatorcontrib>LEE DAI-GIL</creatorcontrib><creatorcontrib>LEE SEUNG-MIN</creatorcontrib><creatorcontrib>CHIN WOO-SEOK</creatorcontrib><creatorcontrib>KWON JAE-WOOK</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HWANG HUI-YUN</au><au>YOON SOON-HO</au><au>KIM BYUNGUL</au><au>LEE DAI-GIL</au><au>LEE SEUNG-MIN</au><au>CHIN WOO-SEOK</au><au>KWON JAE-WOOK</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>NONDESTRUCTIVE RELIABILITY MONITORING METHOD FOR ADHESIVELY BONDED STRUCTURES WHOSE SENSITIVITY IS IMPROVED BY USING PIEZOELECTRIC OR CONDUCTIVE MATERIALS</title><date>2007-09-20</date><risdate>2007</risdate><abstract>A method is disclosed for testing bonded part integrity of bonded structures with increased sensitivity and in a nondestructive manner. The method includes the steps of: mixing a piezoelectric material or an electrically conductive material with an adhesive agent, curing the adhesive agent in between bonding target objects, electrically connecting the bonding target objects to one another, causing an electric current to flow through the bonding target objects to measure a quantity of electric charges flowing between the bonding target objects, and determining existence of bonding damage between the bonding target objects and the adhesive agent based on the quantity of electric charges and predicting a remaining life span of the bonded structures based on a data indicating a correlation between the quantity of electric charges and a predetermined fatigue life.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US2007214623A1 |
| source | esp@cenet |
| subjects | DEAF-AID SETS ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS PUBLIC ADDRESS SYSTEMS TESTING |
| title | NONDESTRUCTIVE RELIABILITY MONITORING METHOD FOR ADHESIVELY BONDED STRUCTURES WHOSE SENSITIVITY IS IMPROVED BY USING PIEZOELECTRIC OR CONDUCTIVE MATERIALS |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-04T18%3A27%3A34IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HWANG%20HUI-YUN&rft.date=2007-09-20&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2007214623A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |