Integrated circuit package with improved power signal connection

An integrated circuit (IC) package includes a substrate and an IC die mounted on a first side of the substrate. The IC package also includes a plurality of capacitors mounted on a second side of the substrate. The second side is opposite to the first side. The IC package further includes a plurality...

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Bibliographische Detailangaben

Hauptverfasser:	RADHAKRISHNAN KALADHAR, WOOD DUSTIN P
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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