Manufacturing method of semiconductor device and semiconductor device

In a dividing method according to the present invention, a wiring board formed of ceramic is forced up (upper swing) by a lower clamp claw of a clamper, and some of a protruded wiring board portion protruding from a conveying chute is pressed against a support body to perform a first division under...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	IDA TSUTOMU, SATO SUSUMU, NAKAJIMA HIROKAZU, KUDAISHI TOMOAKI, YAMADA TOMIO, NIITSU TOSHIHARU, KOBAYASHI YOSHIHIKO, TANIMOTO KOKI, SHIOKAWA YOSHINORI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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