Manufacturing method for printing circuit
A manufacturing method for a printing circuit uses an adhesive as a printing material to print a line pattern of a printing circuit on a carrier by means of printing, and then cause an adhesive to stick with a mother film with a release type metal to allow a part of the carrier with the adhesive to...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A manufacturing method for a printing circuit uses an adhesive as a printing material to print a line pattern of a printing circuit on a carrier by means of printing, and then cause an adhesive to stick with a mother film with a release type metal to allow a part of the carrier with the adhesive to pull and attach itself with a metal film, and another part without the adhesive does not pull and attach itself with the metal film such that a metal line is formed on the carrier. The manufacturing method can simplify the manufacturing process of the printing circuit, the line fabrication is very fast, the production efficiency can be enhanced and the production cost is low. |
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