METHOD OF PRODUCING CIRCUIT CARRIERS WITH INTEGRATED PASSIVE COMPONENTS
The present invention relates to a method for producing an electrical subassembly comprising a circuit carrier and at least one passive component which is integrated into the circuit carrier and comprises an electrically functional material. For providing an improved method for manufacturing an elec...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | BOTHE MICHAEL MORBE STEFAN |
| description | The present invention relates to a method for producing an electrical subassembly comprising a circuit carrier and at least one passive component which is integrated into the circuit carrier and comprises an electrically functional material. For providing an improved method for manufacturing an electrical subassembly comprising a circuit carrier and at least one passive component integrated into the circuit carrier, the method ensuring a rapid and inexpensive manufacture on the one hand and permitting a high flexibility on the other hand in the selection of the electrically functional materials involved, the method comprising structuring the circuit carrier, at least one recess being created for the passive element; introducing the electrically functional material in a raw state into the recess of the circuit carrier; converting the electrically functional material from the raw state into a final state by supplying energy. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2007077687A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2007077687A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2007077687A13</originalsourceid><addsrcrecordid>eNqNyrEKwjAQANAsDqL-w4GzEBWMa0iuyQ1NQnKpYykSJ9FC_X9c_ACnt7y1cD2yjxZiBylHWw0FB4ayqcRgdM6EucCN2AMFRpc1o4WkS6EBwcQ-xYCBy1asHtNzabufG7HvkI0_tPk9tmWe7u3VPmMtJymVVOpyVfp4_m99Aa_bLe0</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD OF PRODUCING CIRCUIT CARRIERS WITH INTEGRATED PASSIVE COMPONENTS</title><source>esp@cenet</source><creator>BOTHE MICHAEL ; MORBE STEFAN</creator><creatorcontrib>BOTHE MICHAEL ; MORBE STEFAN</creatorcontrib><description>The present invention relates to a method for producing an electrical subassembly comprising a circuit carrier and at least one passive component which is integrated into the circuit carrier and comprises an electrically functional material. For providing an improved method for manufacturing an electrical subassembly comprising a circuit carrier and at least one passive component integrated into the circuit carrier, the method ensuring a rapid and inexpensive manufacture on the one hand and permitting a high flexibility on the other hand in the selection of the electrically functional materials involved, the method comprising structuring the circuit carrier, at least one recess being created for the passive element; introducing the electrically functional material in a raw state into the recess of the circuit carrier; converting the electrically functional material from the raw state into a final state by supplying energy.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20070405&DB=EPODOC&CC=US&NR=2007077687A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25551,76302</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20070405&DB=EPODOC&CC=US&NR=2007077687A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BOTHE MICHAEL</creatorcontrib><creatorcontrib>MORBE STEFAN</creatorcontrib><title>METHOD OF PRODUCING CIRCUIT CARRIERS WITH INTEGRATED PASSIVE COMPONENTS</title><description>The present invention relates to a method for producing an electrical subassembly comprising a circuit carrier and at least one passive component which is integrated into the circuit carrier and comprises an electrically functional material. For providing an improved method for manufacturing an electrical subassembly comprising a circuit carrier and at least one passive component integrated into the circuit carrier, the method ensuring a rapid and inexpensive manufacture on the one hand and permitting a high flexibility on the other hand in the selection of the electrically functional materials involved, the method comprising structuring the circuit carrier, at least one recess being created for the passive element; introducing the electrically functional material in a raw state into the recess of the circuit carrier; converting the electrically functional material from the raw state into a final state by supplying energy.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAQANAsDqL-w4GzEBWMa0iuyQ1NQnKpYykSJ9FC_X9c_ACnt7y1cD2yjxZiBylHWw0FB4ayqcRgdM6EucCN2AMFRpc1o4WkS6EBwcQ-xYCBy1asHtNzabufG7HvkI0_tPk9tmWe7u3VPmMtJymVVOpyVfp4_m99Aa_bLe0</recordid><startdate>20070405</startdate><enddate>20070405</enddate><creator>BOTHE MICHAEL</creator><creator>MORBE STEFAN</creator><scope>EVB</scope></search><sort><creationdate>20070405</creationdate><title>METHOD OF PRODUCING CIRCUIT CARRIERS WITH INTEGRATED PASSIVE COMPONENTS</title><author>BOTHE MICHAEL ; MORBE STEFAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2007077687A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2007</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>BOTHE MICHAEL</creatorcontrib><creatorcontrib>MORBE STEFAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BOTHE MICHAEL</au><au>MORBE STEFAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD OF PRODUCING CIRCUIT CARRIERS WITH INTEGRATED PASSIVE COMPONENTS</title><date>2007-04-05</date><risdate>2007</risdate><abstract>The present invention relates to a method for producing an electrical subassembly comprising a circuit carrier and at least one passive component which is integrated into the circuit carrier and comprises an electrically functional material. For providing an improved method for manufacturing an electrical subassembly comprising a circuit carrier and at least one passive component integrated into the circuit carrier, the method ensuring a rapid and inexpensive manufacture on the one hand and permitting a high flexibility on the other hand in the selection of the electrically functional materials involved, the method comprising structuring the circuit carrier, at least one recess being created for the passive element; introducing the electrically functional material in a raw state into the recess of the circuit carrier; converting the electrically functional material from the raw state into a final state by supplying energy.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US2007077687A1 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | METHOD OF PRODUCING CIRCUIT CARRIERS WITH INTEGRATED PASSIVE COMPONENTS |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-15T17%3A44%3A21IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=BOTHE%20MICHAEL&rft.date=2007-04-05&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2007077687A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |