METHOD OF FABRICATING CONDUCTIVE LAYER

A method of fabricating a patterned conductive layer is provided. First, a conductive layer whose material includes at least aluminum-copper (Al-Cu) alloy is formed on a substrate. Then, a heat treatment process is performed to heat the conductive layer to a temperature higher than the phase change...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HUANG CHIEN-HSIN, YEN WEN-PING
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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