METHOD AND APPARATUS FOR REMOVING KNOWN GOOD DIE

A method and structure is disclosed for detaching a chip from a substrate that delays the delivery of shear force to the chip until the connectors attaching the chip to the substrate are soft enough that the delivery of shear force will not damage the chip's connectors. More particularly, the s...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: BOLDE LANNIE R, KAPAMMER MARK W, COVELL JAMES H
Format: Patent
Sprache:eng
Schlagworte:
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