CHIP REVERSING DEVICE AND CHIP REVERSING METHOD, AND CHIP MOUNTING APPARATUS AND CHIP MOUNTING METHOD

In a chip reversing device used in a chip mounting apparatus for holding and vertically reversing a chip placed by a bonding nozzle, the chip is held on a chip holding unit disposed in a reversing member and is vertically reversed by turning the reversing member downward on an reversal shaft. After...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MAKINO YOICHI, KABESHITA AKIRA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING
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