CHIP REVERSING DEVICE AND CHIP REVERSING METHOD, AND CHIP MOUNTING APPARATUS AND CHIP MOUNTING METHOD
In a chip reversing device used in a chip mounting apparatus for holding and vertically reversing a chip placed by a bonding nozzle, the chip is held on a chip holding unit disposed in a reversing member and is vertically reversed by turning the reversing member downward on an reversal shaft. After...
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| creator | MAKINO YOICHI KABESHITA AKIRA |
| description | In a chip reversing device used in a chip mounting apparatus for holding and vertically reversing a chip placed by a bonding nozzle, the chip is held on a chip holding unit disposed in a reversing member and is vertically reversed by turning the reversing member downward on an reversal shaft. After the reversed chip was received by a chip receiving unit, this chip receiving unit is lowered to a retracted position to return the reversing member to an original position. In this state, the chip receiving unit is raised to position the chip at a height level L for a chip transferring action. As a result, the reversing member does not protrude to above the height level for the chip transfer thereby to interfere with another mechanism, so that the chip mounting actions can be made efficient. |
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After the reversed chip was received by a chip receiving unit, this chip receiving unit is lowered to a retracted position to return the reversing member to an original position. In this state, the chip receiving unit is raised to position the chip at a height level L for a chip transferring action. 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After the reversed chip was received by a chip receiving unit, this chip receiving unit is lowered to a retracted position to return the reversing member to an original position. In this state, the chip receiving unit is raised to position the chip at a height level L for a chip transferring action. As a result, the reversing member does not protrude to above the height level for the chip transfer thereby to interfere with another mechanism, so that the chip mounting actions can be made efficient.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZEh19vAMUAhyDXMNCvb0c1dwcQ3zdHZVcPRzUUCT8XUN8fB30UFI-fqH-oWAZBwDAhyDHENCg7HIQXTxMLCmJeYUp_JCaW4GZTfXEGcP3dSC_PjU4oLE5NS81JL40GAjAwNzA2NLMwszR0Nj4lQBACC_NXY</recordid><startdate>20070222</startdate><enddate>20070222</enddate><creator>MAKINO YOICHI</creator><creator>KABESHITA AKIRA</creator><scope>EVB</scope></search><sort><creationdate>20070222</creationdate><title>CHIP REVERSING DEVICE AND CHIP REVERSING METHOD, AND CHIP MOUNTING APPARATUS AND CHIP MOUNTING METHOD</title><author>MAKINO YOICHI ; KABESHITA AKIRA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2007039686A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2007</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>MAKINO YOICHI</creatorcontrib><creatorcontrib>KABESHITA AKIRA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MAKINO YOICHI</au><au>KABESHITA AKIRA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CHIP REVERSING DEVICE AND CHIP REVERSING METHOD, AND CHIP MOUNTING APPARATUS AND CHIP MOUNTING METHOD</title><date>2007-02-22</date><risdate>2007</risdate><abstract>In a chip reversing device used in a chip mounting apparatus for holding and vertically reversing a chip placed by a bonding nozzle, the chip is held on a chip holding unit disposed in a reversing member and is vertically reversed by turning the reversing member downward on an reversal shaft. After the reversed chip was received by a chip receiving unit, this chip receiving unit is lowered to a retracted position to return the reversing member to an original position. In this state, the chip receiving unit is raised to position the chip at a height level L for a chip transferring action. As a result, the reversing member does not protrude to above the height level for the chip transfer thereby to interfere with another mechanism, so that the chip mounting actions can be made efficient.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING |
| title | CHIP REVERSING DEVICE AND CHIP REVERSING METHOD, AND CHIP MOUNTING APPARATUS AND CHIP MOUNTING METHOD |
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