POD SWAPPING INTERNAL TO TOOL RUN TIME
Methods, systems and apparatus for swapping pods within a semiconductor processing tool during a substrate processing cycle. A dirty pod carrying a substrate in need of processing is provided within the processing tool, and the substrate is transferred into a processing chamber thereof. At least one...
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creator | GIFFORD JEFFREY P SHERWOOD EDWARD |
description | Methods, systems and apparatus for swapping pods within a semiconductor processing tool during a substrate processing cycle. A dirty pod carrying a substrate in need of processing is provided within the processing tool, and the substrate is transferred into a processing chamber thereof. At least one clean pod is also provided within the processing tool. Upon substrate processing completion, the processed substrate is transferred from the chamber directly into a clean pod within the processing tool. Wherein a plurality of substrates are processed within the chamber, a plurality of clean pods may be provided within the tool whereby the plurality of substrates are transferred into a single clean pod or split into subsets that are transferred into different clean pods within the processing tool. The clean pod(s) carrying the processed substrate(s) are then transferred to other tool(s) for continued semiconductor fabrication processing. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2006263197A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2006263197A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2006263197A13</originalsourceid><addsrcrecordid>eNrjZFAL8HdRCA53DAjw9HNX8PQLcQ3yc_RRCPEHIn8fhaBQP4UQT19XHgbWtMSc4lReKM3NoOzmGuLsoZtakB-fWlyQmJyal1oSHxpsZGBgZmRmbGhp7mhoTJwqAE3EJHc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>POD SWAPPING INTERNAL TO TOOL RUN TIME</title><source>esp@cenet</source><creator>GIFFORD JEFFREY P ; SHERWOOD EDWARD</creator><creatorcontrib>GIFFORD JEFFREY P ; SHERWOOD EDWARD</creatorcontrib><description>Methods, systems and apparatus for swapping pods within a semiconductor processing tool during a substrate processing cycle. A dirty pod carrying a substrate in need of processing is provided within the processing tool, and the substrate is transferred into a processing chamber thereof. At least one clean pod is also provided within the processing tool. Upon substrate processing completion, the processed substrate is transferred from the chamber directly into a clean pod within the processing tool. Wherein a plurality of substrates are processed within the chamber, a plurality of clean pods may be provided within the tool whereby the plurality of substrates are transferred into a single clean pod or split into subsets that are transferred into different clean pods within the processing tool. The clean pod(s) carrying the processed substrate(s) are then transferred to other tool(s) for continued semiconductor fabrication processing.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CONVEYING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC ; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS ; HANDLING THIN OR FILAMENTARY MATERIAL ; HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS,CABLES ; PACKING ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; STORING ; TECHNICAL SUBJECTS COVERED BY FORMER USPC ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS ; TRANSPORTING</subject><creationdate>2006</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20061123&DB=EPODOC&CC=US&NR=2006263197A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20061123&DB=EPODOC&CC=US&NR=2006263197A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GIFFORD JEFFREY P</creatorcontrib><creatorcontrib>SHERWOOD EDWARD</creatorcontrib><title>POD SWAPPING INTERNAL TO TOOL RUN TIME</title><description>Methods, systems and apparatus for swapping pods within a semiconductor processing tool during a substrate processing cycle. A dirty pod carrying a substrate in need of processing is provided within the processing tool, and the substrate is transferred into a processing chamber thereof. At least one clean pod is also provided within the processing tool. Upon substrate processing completion, the processed substrate is transferred from the chamber directly into a clean pod within the processing tool. Wherein a plurality of substrates are processed within the chamber, a plurality of clean pods may be provided within the tool whereby the plurality of substrates are transferred into a single clean pod or split into subsets that are transferred into different clean pods within the processing tool. The clean pod(s) carrying the processed substrate(s) are then transferred to other tool(s) for continued semiconductor fabrication processing.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CONVEYING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</subject><subject>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</subject><subject>HANDLING THIN OR FILAMENTARY MATERIAL</subject><subject>HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS,CABLES</subject><subject>PACKING</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>STORING</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2006</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAL8HdRCA53DAjw9HNX8PQLcQ3yc_RRCPEHIn8fhaBQP4UQT19XHgbWtMSc4lReKM3NoOzmGuLsoZtakB-fWlyQmJyal1oSHxpsZGBgZmRmbGhp7mhoTJwqAE3EJHc</recordid><startdate>20061123</startdate><enddate>20061123</enddate><creator>GIFFORD JEFFREY P</creator><creator>SHERWOOD EDWARD</creator><scope>EVB</scope></search><sort><creationdate>20061123</creationdate><title>POD SWAPPING INTERNAL TO TOOL RUN TIME</title><author>GIFFORD JEFFREY P ; SHERWOOD EDWARD</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2006263197A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2006</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CONVEYING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</topic><topic>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</topic><topic>HANDLING THIN OR FILAMENTARY MATERIAL</topic><topic>HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS,CABLES</topic><topic>PACKING</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>STORING</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>GIFFORD JEFFREY P</creatorcontrib><creatorcontrib>SHERWOOD EDWARD</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>GIFFORD JEFFREY P</au><au>SHERWOOD EDWARD</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>POD SWAPPING INTERNAL TO TOOL RUN TIME</title><date>2006-11-23</date><risdate>2006</risdate><abstract>Methods, systems and apparatus for swapping pods within a semiconductor processing tool during a substrate processing cycle. A dirty pod carrying a substrate in need of processing is provided within the processing tool, and the substrate is transferred into a processing chamber thereof. At least one clean pod is also provided within the processing tool. Upon substrate processing completion, the processed substrate is transferred from the chamber directly into a clean pod within the processing tool. Wherein a plurality of substrates are processed within the chamber, a plurality of clean pods may be provided within the tool whereby the plurality of substrates are transferred into a single clean pod or split into subsets that are transferred into different clean pods within the processing tool. The clean pod(s) carrying the processed substrate(s) are then transferred to other tool(s) for continued semiconductor fabrication processing.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS CONVEYING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS HANDLING THIN OR FILAMENTARY MATERIAL HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS,CABLES PACKING PERFORMING OPERATIONS SEMICONDUCTOR DEVICES STORING TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS TRANSPORTING |
title | POD SWAPPING INTERNAL TO TOOL RUN TIME |
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