INTEGRATED CIRCUIT DEVICE WITH TREATED PERIMETER EDGE

An integrated circuit die and method of fabricating the same. The method comprises further grinding, polishing or otherwise treating one or more perimeter edges of an individual circuit die. The perimeter edges are treated to remove a substantial portion of the remaining substrate material layer or...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	SCHOENFELD AARON
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS
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