Lid used in package structure and the package structure having the same

The present invention relates to a lid and a package structure having the same. The package structure comprises a first substrate, a first chip, a lid and a second package. The first chip is disposed on and electrically connected to the top surface of the first substrate. The lid is disposed on the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	JEONG TAEJUN, RHO KYUNGSOO, LEE YONGGILL
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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