Power semiconductor module

The invention proposes a power semiconductor module with a housing ( 1 ) that consists of a hardenable plastic casting compound and a base plate ( 2 ), wherein electric power semiconductor components ( 4 ) are arranged on a section of the surface of the base plate ( 2 ) that faces the housing ( 1 )...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KESER HELMUT, KNAPP WOLFGANG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DEAF-AID SETS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS PUBLIC ADDRESS SYSTEMS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The invention proposes a power semiconductor module with a housing ( 1 ) that consists of a hardenable plastic casting compound and a base plate ( 2 ), wherein electric power semiconductor components ( 4 ) are arranged on a section of the surface of the base plate ( 2 ) that faces the housing ( 1 ) by means of an insulating layer ( 5 ). At least the section of the surface of the base plate ( 2 ) that faces of the housing ( 1 ) and contains the electric power semiconductor components ( 4 ) is encapsulated in the housing( ), wherein the hardenable plastic casting compound has a hardness between 30 and 95 ShoreA.