Cooling jacket
A cooling jacket for cooling a heat-generating element 300 through transmitting heat-generation therein into a coolant flowing within an inside thereof, which is mounted within an electronic apparatus, comprises a base portion 110 , having a heat-transfer surface 111 to be contact on a surface of th...
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| creator | ATARASHI TAKAYUKI NAKANISHI MASATO |
| description | A cooling jacket for cooling a heat-generating element 300 through transmitting heat-generation therein into a coolant flowing within an inside thereof, which is mounted within an electronic apparatus, comprises a base portion 110 , having a heat-transfer surface 111 to be contact on a surface of the heat-generating element, and a plural number of wall portions 113 , each being defined to extend into a direction perpendicular to the heat-transfer surface, thereby defining flow passages 114 for the liquid coolant between the wall portions; and a cover portion 120 , being attached on the base portion surrounding a periphery thereof, thereby defining a passage for guiding the liquid coolant into the base portion, wherein the base portion builds up the sector-like shaped flow passages and a summit portion at a central portion of the base, and has a configuration being thermally isotropic to the heat-generating element to be contact thereon. |
| format | Patent |
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and a cover portion 120 , being attached on the base portion surrounding a periphery thereof, thereby defining a passage for guiding the liquid coolant into the base portion, wherein the base portion builds up the sector-like shaped flow passages and a summit portion at a central portion of the base, and has a configuration being thermally isotropic to the heat-generating element to be contact thereon.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2006</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20061005&DB=EPODOC&CC=US&NR=2006219387A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20061005&DB=EPODOC&CC=US&NR=2006219387A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ATARASHI TAKAYUKI</creatorcontrib><creatorcontrib>NAKANISHI MASATO</creatorcontrib><title>Cooling jacket</title><description>A cooling jacket for cooling a heat-generating element 300 through transmitting heat-generation therein into a coolant flowing within an inside thereof, which is mounted within an electronic apparatus, comprises a base portion 110 , having a heat-transfer surface 111 to be contact on a surface of the heat-generating element, and a plural number of wall portions 113 , each being defined to extend into a direction perpendicular to the heat-transfer surface, thereby defining flow passages 114 for the liquid coolant between the wall portions; and a cover portion 120 , being attached on the base portion surrounding a periphery thereof, thereby defining a passage for guiding the liquid coolant into the base portion, wherein the base portion builds up the sector-like shaped flow passages and a summit portion at a central portion of the base, and has a configuration being thermally isotropic to the heat-generating element to be contact thereon.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2006</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOBzzs_PycxLV8hKTM5OLeFhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGBmZGhpbGFuaOhsbEqQIAyEEfUg</recordid><startdate>20061005</startdate><enddate>20061005</enddate><creator>ATARASHI TAKAYUKI</creator><creator>NAKANISHI MASATO</creator><scope>EVB</scope></search><sort><creationdate>20061005</creationdate><title>Cooling jacket</title><author>ATARASHI TAKAYUKI ; 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and a cover portion 120 , being attached on the base portion surrounding a periphery thereof, thereby defining a passage for guiding the liquid coolant into the base portion, wherein the base portion builds up the sector-like shaped flow passages and a summit portion at a central portion of the base, and has a configuration being thermally isotropic to the heat-generating element to be contact thereon.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | Cooling jacket |
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