Processing apparatus and processing method

A processing apparatus according to the present invention, which conditions a substrate placed on a table equipped with a heater by radiating an electron beam onto the substrate while heating the substrate with the heater, includes at least three projecting portions for holding the substrate at a pr...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KAMIGORI AKIKO, ONISHI TADASHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	A processing apparatus according to the present invention, which conditions a substrate placed on a table equipped with a heater by radiating an electron beam onto the substrate while heating the substrate with the heater, includes at least three projecting portions for holding the substrate at a predetermined distance from the table. This structure minimizes the extent of uneven heating of the substrate, which, in turn, enables uniform processing of the surface on the substrate.