Method of forming electronic devices

Method of forming electronic devices

A method of forming polymer reinforced solder-bumped containing device or substrate is described. The method comprises the following steps: providing a device or substrate having at least one solder bump formed thereon; coating a predetermined portion of the device or substrate with a curable polyme...

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Hauptverfasser: ESLER DAVID R, MILLS RYAN C, CAMPBELL JOHN R, GOWDA ARUN V, PRABHAKUMAR ANANTH, TONAPI SANDEEP S, BUCKLEY DONALD J.JR
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator ESLER DAVID R
MILLS RYAN C
CAMPBELL JOHN R
GOWDA ARUN V
PRABHAKUMAR ANANTH
TONAPI SANDEEP S
BUCKLEY DONALD J.JR
description A method of forming polymer reinforced solder-bumped containing device or substrate is described. The method comprises the following steps: providing a device or substrate having at least one solder bump formed thereon; coating a predetermined portion of the device or substrate with a curable polymer reinforcement material forming a layer on the device or substrate, partially curing the curable polymer reinforcement material to provide a solder-bumped structure comprising a partially cured polymer reinforcement material, and, making a connection between the solder-bumped structure formed and a printed circuit board or array of attachment pads and fully curing the partially cured polymer reinforcement material to provide a reinforced interconnection. Full curing of the polymer reinforcement material may take place either during the "reflow step" or subsequent to it (post-curing).
format Patent
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Method of forming electronic devices
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