Method for applying metal features onto barrier layers using ion permeable barriers

The methods described are directed to processes for producing structures containing metallized features for use in microelectronic workpieces. The processes treat a barrier layer to promote the adhesion between the barrier layer and the metallized feature. Suitable means for promoting adhesion betwe...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIM BIOH, RITZDORF TOM L, BASKARAN RAJESH, HANSON KYLE M, BATZ ROBERT W.JR, KLOCKE JOHN L
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
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