Test kit semiconductor package and method of testing semiconductor package using the same

A test kit for a semiconductor package and a method of testing a semiconductor package using the same are provided. The test kit may include a pick-and-place tool for loading/unloading a semiconductor package, a head assembly for guiding a semiconductor package released from the pick-and-place tool,...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BANG JEONG-HO, YUN KUM-JIN, SHIM HYUN-SEOP, IY HYUN-GUEN, LEE JAE-IL
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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