Test kit semiconductor package and method of testing semiconductor package using the same

A test kit for a semiconductor package and a method of testing a semiconductor package using the same are provided. The test kit may include a pick-and-place tool for loading/unloading a semiconductor package, a head assembly for guiding a semiconductor package released from the pick-and-place tool,...

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Hauptverfasser:	BANG JEONG-HO, YUN KUM-JIN, SHIM HYUN-SEOP, IY HYUN-GUEN, LEE JAE-IL
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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creator	BANG JEONG-HO YUN KUM-JIN SHIM HYUN-SEOP IY HYUN-GUEN LEE JAE-IL
description	A test kit for a semiconductor package and a method of testing a semiconductor package using the same are provided. The test kit may include a pick-and-place tool for loading/unloading a semiconductor package, a head assembly for guiding a semiconductor package released from the pick-and-place tool, and a socket for receiving the semiconductor package from the pick-and-place tool. The method may include performing pre-alignment by inserting one or more slide posts of an alignment tool into a socket, releasing a semiconductor package through a package guider, and attaching the semiconductor package onto a socket.
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title	Test kit semiconductor package and method of testing semiconductor package using the same
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