Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles

Techniques for ball bonding wires in an integrated circuit are provided which allow formation of desired wire bond profile shapes for optimal performance. A wire is ball bonded to a first bond site in the integrated circuit with a bonding tool and at least one bend is formed in the wire. The wire is...

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Bibliographische Detailangaben

Hauptverfasser:	MILLER CURTIS J, TRONCOSO NELSON
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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