Microelectronic packages using a ceramic substrate having a window and a conductive surface region

Microelectronic packages using a ceramic substrate having a window and a conductive surface region

A microelectronic package includes a microelectronic device, a unitary ceramic substrate, and a plurality of terminals. The microelectronic device has a front surface and a plurality of electrical contacts thereon. The substrate has first and second opposing surfaces. A window extends from a first o...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LIEW VICTOR, HUMPSTON GILES
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator LIEW VICTOR
HUMPSTON GILES
description A microelectronic package includes a microelectronic device, a unitary ceramic substrate, and a plurality of terminals. The microelectronic device has a front surface and a plurality of electrical contacts thereon. The substrate has first and second opposing surfaces. A window extends from a first opening on the first surface along a side wall to a second opening on the second surface. A conductive region may be provided on the side wall and/or the second substrate surface. The substrate is located between the device and the terminals such that the first surface of the substrate faces the front surface of the device and the first opening is aligned with at least one contact on the front device surface. Also provided are methods for producing microelectronic packages and wafer-scale assemblies.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2006138626A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2006138626A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2006138626A13</originalsourceid><addsrcrecordid>eNqNzbsKwkAQheE0FqK-w4C1kAsEWxHFxkqtw2RykizG2bC7SV7fiD6A1Sn-D84yKq9GnEUHCc6qEepZntzA0-CNNsQkcPyagx9KHxwHUMvjN01GKzsRa_VxVqtBghkxU1ezgBwaY3UdLWruPDa_XUXb8-l-vOzQ2wJ-PoQiFI9bGsd5ku3zND8k2X_qDWbQPyU</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Microelectronic packages using a ceramic substrate having a window and a conductive surface region</title><source>esp@cenet</source><creator>LIEW VICTOR ; HUMPSTON GILES</creator><creatorcontrib>LIEW VICTOR ; HUMPSTON GILES</creatorcontrib><description>A microelectronic package includes a microelectronic device, a unitary ceramic substrate, and a plurality of terminals. The microelectronic device has a front surface and a plurality of electrical contacts thereon. The substrate has first and second opposing surfaces. A window extends from a first opening on the first surface along a side wall to a second opening on the second surface. A conductive region may be provided on the side wall and/or the second substrate surface. The substrate is located between the device and the terminals such that the first surface of the substrate faces the front surface of the device and the first opening is aligned with at least one contact on the front device surface. Also provided are methods for producing microelectronic packages and wafer-scale assemblies.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2006</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20060629&amp;DB=EPODOC&amp;CC=US&amp;NR=2006138626A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20060629&amp;DB=EPODOC&amp;CC=US&amp;NR=2006138626A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIEW VICTOR</creatorcontrib><creatorcontrib>HUMPSTON GILES</creatorcontrib><title>Microelectronic packages using a ceramic substrate having a window and a conductive surface region</title><description>A microelectronic package includes a microelectronic device, a unitary ceramic substrate, and a plurality of terminals. The microelectronic device has a front surface and a plurality of electrical contacts thereon. The substrate has first and second opposing surfaces. A window extends from a first opening on the first surface along a side wall to a second opening on the second surface. A conductive region may be provided on the side wall and/or the second substrate surface. The substrate is located between the device and the terminals such that the first surface of the substrate faces the front surface of the device and the first opening is aligned with at least one contact on the front device surface. Also provided are methods for producing microelectronic packages and wafer-scale assemblies.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2006</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNzbsKwkAQheE0FqK-w4C1kAsEWxHFxkqtw2RykizG2bC7SV7fiD6A1Sn-D84yKq9GnEUHCc6qEepZntzA0-CNNsQkcPyagx9KHxwHUMvjN01GKzsRa_VxVqtBghkxU1ezgBwaY3UdLWruPDa_XUXb8-l-vOzQ2wJ-PoQiFI9bGsd5ku3zND8k2X_qDWbQPyU</recordid><startdate>20060629</startdate><enddate>20060629</enddate><creator>LIEW VICTOR</creator><creator>HUMPSTON GILES</creator><scope>EVB</scope></search><sort><creationdate>20060629</creationdate><title>Microelectronic packages using a ceramic substrate having a window and a conductive surface region</title><author>LIEW VICTOR ; HUMPSTON GILES</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2006138626A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2006</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LIEW VICTOR</creatorcontrib><creatorcontrib>HUMPSTON GILES</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIEW VICTOR</au><au>HUMPSTON GILES</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Microelectronic packages using a ceramic substrate having a window and a conductive surface region</title><date>2006-06-29</date><risdate>2006</risdate><abstract>A microelectronic package includes a microelectronic device, a unitary ceramic substrate, and a plurality of terminals. The microelectronic device has a front surface and a plurality of electrical contacts thereon. The substrate has first and second opposing surfaces. A window extends from a first opening on the first surface along a side wall to a second opening on the second surface. A conductive region may be provided on the side wall and/or the second substrate surface. The substrate is located between the device and the terminals such that the first surface of the substrate faces the front surface of the device and the first opening is aligned with at least one contact on the front device surface. Also provided are methods for producing microelectronic packages and wafer-scale assemblies.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2006138626A1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Microelectronic packages using a ceramic substrate having a window and a conductive surface region
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-21T18%3A45%3A35IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LIEW%20VICTOR&rft.date=2006-06-29&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2006138626A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true