Semiconductor device and a method of manufacturing the same

It is intended to improve the production yield of QFN (Quad Flat Non-leaded package) and attain a multi-pin structure. After a resin sealing member for sealing a semiconductor chip is formed by molding, a peripheral portion of the resin sealing member and a lead frame are both cut along a cutting li...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MURAKAMI FUMIO, TAKENO HIROYUKI, SHIMOJI HIROSHI, KURAKAWA KEIKO, SUZUKI HIROMICHI, ITO FUJIO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!