Method and apparatus for circuit completion through the use of ball bonds or other connections during the formation of a semiconductor device

A method used to form a semiconductor device comprises providing first and second circuit portions having first and second pad portions respectively. The second circuit portion is electrically isolated from the first circuit portion. The first and second pad portions are then electrically connected,...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	REYNOLDS TRACY, FOGAL RICH, COWLES TIMOTHY
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INFORMATION STORAGE PHYSICS SEMICONDUCTOR DEVICES STATIC STORES
Online-Zugang:	Volltext bestellen
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