Method of chemical mechanical polishing, and a pad provided therefore

In a chemical mechanical polishing for removing a barrier and subsequent buffing a polyurethane polishing pad is used which is composed of for removal a barrier and buffing after a bulk copper removal to the barrier in a chemical mechanical polishing of a copper film deposited on a surface of a semi...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	RENTELN PETER
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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