Method of making a circuitized substrate having a plurality of solder connection sites thereon

Method of making a circuitized substrate having a plurality of solder connection sites thereon

A method of making a circuitized substrate in which two solder deposits, either of the same or different metallurgies, are formed on at least two different metal or metal alloy conductors and PTHs. In an alternative embodiment, the same solder compositions may be deposited on conductor and PTHs of d...

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Hauptverfasser: RIOS JOSE A, KONRAD JOHN J, KOTYLO JOSEPH A
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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creator RIOS JOSE A
KONRAD JOHN J
KOTYLO JOSEPH A
description A method of making a circuitized substrate in which two solder deposits, either of the same or different metallurgies, are formed on at least two different metal or metal alloy conductors and PTHs. In an alternative embodiment, the same solder compositions may be deposited on conductor and PTHs of different metal or metal alloy composition. In each embodiment, a single commoning layer (e.g., copper) is used, being partially removed following the first deposition. The solder is deposited using an electroplating process (electroless or electrolytic) and the commoning bar in both depositing steps. An information handling system utilizing the circuitized substrate formed in accordance with the invention is also described.
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subjects BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
title Method of making a circuitized substrate having a plurality of solder connection sites thereon
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