Doped contact formations

According to one aspect of the invention, a contact formation and an electronic assembly incorporating the contact formation are provided. The contact formation may include a low temperature solder material and a plurality of dopant material particles within the solder material. The dopant material...

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Bibliographische Detailangaben
Hauptverfasser:	DEPPISCH CARL L, MARTIN EDWARD L, SUH DAEWOONG, BYRNE TIFFANY A
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	According to one aspect of the invention, a contact formation and an electronic assembly incorporating the contact formation are provided. The contact formation may include a low temperature solder material and a plurality of dopant material particles within the solder material. The dopant material may include at least one of an insoluble metal, an intermetallic compound, and an oxide. The low temperature solder material may have a first liquidus temperature, and the contact formation may have a second liquidus temperature. The second liquidus temperature may be approximately the same as the first liquidus temperature.