Methods of forming lead free solder bumps and related structures

Methods of forming an electronic device may include forming an under bump seed metallurgy layer on an electronic substrate. A nickel layer may be formed on the under bump seed metallurgy layer so that the under bump seed metallurgy layer is between the nickel layer and the electronic substrate, and...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BUMGARNER SUSAN, RINNE GLENN, ADEMA GRETCHEN, CHILUKURI POOJA, RINNE CHRISTINE, MIS J. D
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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