EMI filter terminal assembly with wire bond pads for human implant applications

An electromagnetic interference filter terminal assembly for active implantable medical devices includes a structural pad in the form of a substrate or attached wire bond pad, for convenient attachment of wires from the circuitry inside the implantable medical device to the capacitor structure via t...

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Bibliographische Detailangaben
Hauptverfasser:	FRYSZ CHRISTINE, KNAPPEN SCOTT, STEVENSON RYAN A, STEVENSON ROBERT A, BRENDEL RICHARD L, HUSSEIN HAYTHAM
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY ELECTROTHERAPY EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS GENERATION HUMAN NECESSITIES HYGIENE MAGNETOTHERAPY MEDICAL OR VETERINARY SCIENCE RADIATION THERAPY ULTRASOUND THERAPY
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Beschreibung
Zusammenfassung:	An electromagnetic interference filter terminal assembly for active implantable medical devices includes a structural pad in the form of a substrate or attached wire bond pad, for convenient attachment of wires from the circuitry inside the implantable medical device to the capacitor structure via thermal or ultrasonic bonding, soldering or the like while shielding the capacitor from forces applied to the assembly during attachment of the wires.