Method of fabricating multilayer ceramic substrate

A method of fabricating a multilayer ceramic substrate includes stacking one or a plurality of unfired ceramic greensheets on one or both sides of a previously fired ceramic substrate, thereby forming a stack, each unfired ceramic greensheet having a firing temperature substantially equal to or lowe...

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Hauptverfasser: NAKA KATSUHIKO, NAKANO SATOSHI, FUKUTA JUNZO, MIZUNO YOSHIO
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creator NAKA KATSUHIKO
NAKANO SATOSHI
FUKUTA JUNZO
MIZUNO YOSHIO
description A method of fabricating a multilayer ceramic substrate includes stacking one or a plurality of unfired ceramic greensheets on one or both sides of a previously fired ceramic substrate, thereby forming a stack, each unfired ceramic greensheet having a firing temperature substantially equal to or lower than a firing temperature of the previously fired ceramic substrate, stacking a restricting greensheet on the unfired ceramic greensheet composing an outermost layer of the stack, the restricting greensheet having a higher firing temperature than each unfired ceramic greensheet, firing the stack at the firing temperature of the unfired ceramic green sheets with or without pressure applied via the restricting greensheet while the stack is under restriction by the restricting greensheet, thereby integrating the stack, and eliminating remainders of the restricting greensheet after the firing step.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2005199331A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2005199331A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2005199331A13</originalsourceid><addsrcrecordid>eNrjZDDyTS3JyE9RyE9TSEtMKspMTizJzEtXyC3NKcnMSaxMLVJITi1KzM1MViguTSouKUosSeVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGBqaGlpbGxoaOhsbEqQIAmq0tWA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method of fabricating multilayer ceramic substrate</title><source>esp@cenet</source><creator>NAKA KATSUHIKO ; NAKANO SATOSHI ; FUKUTA JUNZO ; MIZUNO YOSHIO</creator><creatorcontrib>NAKA KATSUHIKO ; NAKANO SATOSHI ; FUKUTA JUNZO ; MIZUNO YOSHIO</creatorcontrib><description>A method of fabricating a multilayer ceramic substrate includes stacking one or a plurality of unfired ceramic greensheets on one or both sides of a previously fired ceramic substrate, thereby forming a stack, each unfired ceramic greensheet having a firing temperature substantially equal to or lower than a firing temperature of the previously fired ceramic substrate, stacking a restricting greensheet on the unfired ceramic greensheet composing an outermost layer of the stack, the restricting greensheet having a higher firing temperature than each unfired ceramic greensheet, firing the stack at the firing temperature of the unfired ceramic green sheets with or without pressure applied via the restricting greensheet while the stack is under restriction by the restricting greensheet, thereby integrating the stack, and eliminating remainders of the restricting greensheet after the firing step.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2005</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20050915&amp;DB=EPODOC&amp;CC=US&amp;NR=2005199331A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20050915&amp;DB=EPODOC&amp;CC=US&amp;NR=2005199331A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NAKA KATSUHIKO</creatorcontrib><creatorcontrib>NAKANO SATOSHI</creatorcontrib><creatorcontrib>FUKUTA JUNZO</creatorcontrib><creatorcontrib>MIZUNO YOSHIO</creatorcontrib><title>Method of fabricating multilayer ceramic substrate</title><description>A method of fabricating a multilayer ceramic substrate includes stacking one or a plurality of unfired ceramic greensheets on one or both sides of a previously fired ceramic substrate, thereby forming a stack, each unfired ceramic greensheet having a firing temperature substantially equal to or lower than a firing temperature of the previously fired ceramic substrate, stacking a restricting greensheet on the unfired ceramic greensheet composing an outermost layer of the stack, the restricting greensheet having a higher firing temperature than each unfired ceramic greensheet, firing the stack at the firing temperature of the unfired ceramic green sheets with or without pressure applied via the restricting greensheet while the stack is under restriction by the restricting greensheet, thereby integrating the stack, and eliminating remainders of the restricting greensheet after the firing step.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2005</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDDyTS3JyE9RyE9TSEtMKspMTizJzEtXyC3NKcnMSaxMLVJITi1KzM1MViguTSouKUosSeVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGBqaGlpbGxoaOhsbEqQIAmq0tWA</recordid><startdate>20050915</startdate><enddate>20050915</enddate><creator>NAKA KATSUHIKO</creator><creator>NAKANO SATOSHI</creator><creator>FUKUTA JUNZO</creator><creator>MIZUNO YOSHIO</creator><scope>EVB</scope></search><sort><creationdate>20050915</creationdate><title>Method of fabricating multilayer ceramic substrate</title><author>NAKA KATSUHIKO ; NAKANO SATOSHI ; FUKUTA JUNZO ; MIZUNO YOSHIO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2005199331A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2005</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>NAKA KATSUHIKO</creatorcontrib><creatorcontrib>NAKANO SATOSHI</creatorcontrib><creatorcontrib>FUKUTA JUNZO</creatorcontrib><creatorcontrib>MIZUNO YOSHIO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NAKA KATSUHIKO</au><au>NAKANO SATOSHI</au><au>FUKUTA JUNZO</au><au>MIZUNO YOSHIO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method of fabricating multilayer ceramic substrate</title><date>2005-09-15</date><risdate>2005</risdate><abstract>A method of fabricating a multilayer ceramic substrate includes stacking one or a plurality of unfired ceramic greensheets on one or both sides of a previously fired ceramic substrate, thereby forming a stack, each unfired ceramic greensheet having a firing temperature substantially equal to or lower than a firing temperature of the previously fired ceramic substrate, stacking a restricting greensheet on the unfired ceramic greensheet composing an outermost layer of the stack, the restricting greensheet having a higher firing temperature than each unfired ceramic greensheet, firing the stack at the firing temperature of the unfired ceramic green sheets with or without pressure applied via the restricting greensheet while the stack is under restriction by the restricting greensheet, thereby integrating the stack, and eliminating remainders of the restricting greensheet after the firing step.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
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source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
title Method of fabricating multilayer ceramic substrate
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-23T17%3A43%3A45IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=NAKA%20KATSUHIKO&rft.date=2005-09-15&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2005199331A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true