Apparatus and method for fixing component of circuit substrate

Apparatus and method for fixing component of circuit substrate

It is intended to provide a component fixing device capable of improving vibration resistance by fixing a component onto a circuit substrate without inhibiting productivity and, of accurately inserting a lead of the component into the circuit substrate. The component fixing device is provided with a...

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1. Verfasser: MATSUO HARUYUKI
Format: Patent
Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator MATSUO HARUYUKI
description It is intended to provide a component fixing device capable of improving vibration resistance by fixing a component onto a circuit substrate without inhibiting productivity and, of accurately inserting a lead of the component into the circuit substrate. The component fixing device is provided with a circuit substrate having a printed wiring or the like, amounting component having a package including electronic components forming an electronic circuit together with the print wiring and an external lead for connecting the electronic components to the print wiring and the like, and a holder made from an insulating material such as a synthetic resin, the holder being fixed to the circuit substrate and holding the mounting component. The holder is provided with holding members for holding and fixing the package of the mounting component and lead holes for guiding the lead to a through hole of the circuit substrate.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Apparatus and method for fixing component of circuit substrate
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