Method of fabricating semiconductor memory device and semiconductor memory device driver

Disclosed is a method of fabricating a semiconductor memory device including the step of irradiating ultraviolet rays on a metal interconnection at a bonding pad part, so that the metal interconnection can be prevented from being corroded because of a corrodent element in the process of erasing char...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MAENOSONO TOSHIYUKI, TAKAGI HIDEO, HASHIMOTO TATSUYA, ENDA TAKAYUKI, TOGAWA TAIJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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