Ultra wideband BGA

Ultra wideband BGA

An electronic device packaging assembly (10) that includes a ball grid array (60) and specialized construction to be able to operate from DC up to 50 GHz with minimal parasitic losses. The packaging assembly (10) includes a thin base plate (14) made of a suitable rigid material. Power vias (48), sig...

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Hauptverfasser: DIN SALAH, CROSSMAN BRIAN F, HATHAWAY JAMES A
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator DIN SALAH
CROSSMAN BRIAN F
HATHAWAY JAMES A
description An electronic device packaging assembly (10) that includes a ball grid array (60) and specialized construction to be able to operate from DC up to 50 GHz with minimal parasitic losses. The packaging assembly (10) includes a thin base plate (14) made of a suitable rigid material. Power vias (48), signal vias (26) and ground vias (46) are formed through the base plate (14) to be coupled to traces, circuit components, and/or the device (12) within the packaging assembly (10). An impedance matching compensation network (28) provides impedance matching between the device (12) and the signal vias (26). The ball grid array (60) includes a plurality of solder balls (68), including ground solder balls (72), signal solder balls (74) and power solder balls (76), electrically coupled to the appropriate via extending through the base plate (14).
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Ultra wideband BGA
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