METHOD FOR FORMING INTERCONNECTS ON THIN WAFERS

A method of forming a semiconductor interconnect including, in the order recited: (a) providing a semiconductor wafer; (b) forming bonding pads in a terminal wiring level on the frontside of the wafer; (c) reducing the thickness of the wafer; (d) forming solder bumps on the bonding pads; and (e) dic...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PROBSTFIELD ERIK M, WIRSING ADOLF E, GARDECKI LEONARD J, PALMER JAMES R
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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