Method to reduce adhesion between a conformable region and a pattern of a mold

The present invention provides a method to reduce adhesion between a conformable region on a substrate and a pattern of a mold, which selectively comes into contact with the conformable region. The method features forming a conformable material on the substrate and contacting the conformable materia...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: XU FRANK Y, TRUSKETT VAN NGUYEN, STACY NICHOLAS A, WATTS MICHAEL P.C, CHOI BYUNG JIN
Format: Patent
Sprache:eng
Schlagworte:
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