Electroplated interconnection structures on integrated circuit chips

A process is described for the fabrication of submicron interconnect structures for integrated circuit chips. Void-free and seamless conductors are obtained by electroplating Cu from baths that contain additives and are conventionally used to deposit level, bright, ductile, and low-stress Cu metal....

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HORKANS WILMA JEAN, HU CHAO-KUN, HURD JEFFREY LOUIS, ANDRICACOS PANAYOTIS CONSTANTINOU, DELIGIANNI HARIKLIA, RODBELL KENNETH PARKER, DUKOVIC JOHN OWEN, WONG KWONG-HON, EDELSTEIN DANIEL CHARLES, UZOH CYPRIAN EMEKA
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
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