Semiconductor wafer front side protection

There is provided a method for making a wafer comprising the steps of providing a substrate having a first surface, an opposite second surface, and at least one side edge defining a thickness of the substrate, the at least one side edge having a first peripheral region and a second peripheral region...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KRYWANCZYK TIMOTHY C, ABRAMS ALLAN D, BROUILLETTE DONALD W, DANAHER JOSEPH D, STONE IVAN J, WHALEN MATTHEW R, LAMOTHE RENE A
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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